Package and Electrostatic Discharge Failure Analysis of Power Semiconductor Device Chip 功率器件芯片封装和静电放电失效分析
DRAM is a semiconductor chip used in most electronic products such as personal computers. 动态随机存取记忆体是应用于电子产品的半导体晶片,如个人电脑等。
Neural cell based biosensors, with neurons cultured on the semiconductor sensor chip, are suitable for long-term and non-invasive measurement of cell electrophysiological properties. 将神经元培养在半导体传感器芯片表面,构建出能够对细胞电生理特性进行长时程无损测量的神经细胞传感器,具有广阔的生物医学应用前景。
Research of Semiconductor Chip Test Data Transmission Method 半导体芯片测试数据传输方法的研究
Application Research of PCM Test Technology on Semiconductor Chip Manufacture 半导体芯片PCM测试技术的应用研究
The charge technology can't be effectively solved by semiconductor chip only, more combining the characteristics of battery material. 充电技术光靠半导体晶片技术是无法有效解决的,更要兼顾电池材料特性。
Intel company is the world's largest semiconductor chip maker, it brings the microprocessor computer and the Internet revolution, changed the whole world. 随着个人电脑的普及,英特尔公司成为世界上最大设计和生产半导体的科技巨擘。
Microcomputer Controling System for Autometic Bonding of Semiconductor Chip Lead 半导体芯片自动引线压焊微型机控制系统热压带式自动焊接的引线
Semiconductor chip testing is very important for wafer fabrication. 半导体芯片的检测是芯片生产企业生产过程中的重要环节,芯片在检测过程中,由于圆形硅片的结构特点而造成的漏测又是困扰芯片生产企业不可小视的实际问题。
Verification of a design is today a major challenge in the semiconductor chip design cycle. 设计验证已经成为半导体芯片设计过程所面临的主要难题之一。
This paper describes the internal cir-cuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module. 在此详细介绍了DIP-CIB模块的内部电路、半导体硅片技术、封装技术,以及如何配合专用的HVIC来实现通用变频器的小型化设计。
Fixed abrasive wire is considered as one of the most promising methods in slicing of large size semiconductor chip and function crystal because of its incomparable advantages. 在大尺寸半导体基片和功能晶体的切割中,固结磨料线锯以无可比拟的优点被认为是最有前途的切割方法之一。
This technology can be widely used for chip encapsulation in the field of micro-electronics. The core of this technology is that it achieves a vision machine to automatically recognize and locate the bonding pad on the unencapsulated semiconductor chip. 这一技术可以广泛应用于微电子行业中的芯片封装技术,它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。
In addition, the legislation protection on the intellectual property right of the integrated circuit was originated from the Semiconductor Chip Protection Act of 1984 of United States. 最早保护集成电路知识产权的立法源于1984年的美国《半导体芯片保护法》。
This paper discussed a semiconductor chip used to analyze DNA liquor in flow injection analysis. 本文介绍了在对DNA溶液进行流动注射分析中所应用的一种半导体芯片。
Parameters of silicon semiconductor chip and bridge section were designed and optimized. The initiation of HNS-ⅳ explosive with SCB lapper was carried out and the factors influencing firing energy were studied. 优化设计了硅半导体芯片及桥区参数,并对SCB冲击片起爆HNS-Ⅳ炸药及影响发火能量的因素进行了试验研究。
SEM analysis of cross sections for semiconductor chip 半导体芯片截面的扫描电镜分析
Power semiconductor device chip manufacturing process is actually repeated several times on film formation, lithography and doping process in a substrate, and its primary task is to solve the problem of film formation. 功率半导体器件芯片制造过程中实际上就是在衬底上多次反复进行的薄膜形成、光刻与掺杂等加工过程,其首要的任务是解决薄膜制备问题。
LED, a novel technology, can change electric energy to light energy by making use of semiconductor chip. LED技术是一种利用半导体芯片研发出来的可以将电能转化为光能的全照明技术。
In recent years, with the rapid development of electronic communication, especially the fast popularization of wireless communication and the ripe of semiconductor chip technology, the short distance wireless communication have already been paid to more and more attention. 近几年来,随着电子通信技术的飞速发展,特别是无线通信技术的迅速普及和半导体芯片技术的不断成熟,短距离无线通信技术已越来越受到大家的重视。
Wafer is the main material to manufacture semiconductor chip, whose quality plays an important role in the field of information. 晶圆作为加工半导体芯片的主要材料,其质量的好坏对信息产业的影响可谓巨大。
With high working voltage and heat source temperature, the needed time of the device to accumulate heat is much shorter. The increased working voltage can enlarge the temperature difference between the hot and cold side of semiconductor chip, and then reduce the heat coefficient. 在工作电压较高,余热热源温度较高的情况下,该装置蓄热所需时间较短;加大工作电压会导致半导体芯片冷热端温差变大从而降低该装置的制热系数。
This Paper proposed solutions for the semiconductor chip and package substrate solderability provide useful help and reference information. 论文提出的解决方案为半导体封装中芯片与基板可焊性提供有益帮助和参考。
The applications of high purity aluminum target material are the semiconductor chip and flat panel displays industry, and rare earth Gd and Ce target materials are magnetic record and optical record industries. 高纯铝靶材主要运用于半导体芯片、平板显示器产业;稀土Gd和Ce靶材主要用于磁记录和光记录产业。
Single crystal silicon wafer has been widely used in the semiconductor industry, as the basic substrate material for the integrated circuits. Ultra-precision grinding technology is the core technology of a semiconductor chip substrate planarization processing and back thinned processing. 单晶硅是优良的衬底材料,被广泛应用于半导体产业中,超精密磨削技术是半导体芯片衬底平坦化加工和背面减薄加工的核心技术。
With highly integrated, almost all kinds of microelectronic semiconductor chip are in the periodic structures, and the technique for measuring the critical dimensions and refractive index of them has shown particularly important. 由于现在微电子半导体芯片的集成度很高,而且几乎各种复杂的微加工形状均是周期性结构,因此对其关键尺寸及材料折射率等进行相关测试的计量技术就显得至关重要。
Considering the application of bridge inspection system, the semiconductor chip used in the intellisense cell has also been briefly introduced including working principles, peripheral circuits and operating conditions, summarized by schematic diagram of hardware connection. 结合桥梁检测的实际情况对感知单元所用器件进行选型,对使用到的主要芯片进行简要介绍,包括芯片工作原理、外围电路以及工作条件等,给出硬件连接原理图。
With the development of the technology of semiconductor and chip, embedded PLC emerges as the time requires. 随着半导体技术、芯片技术的发展,嵌入式PLC芯片组应运而生。
As the continuing improvement of the technology in semiconductor chip design and production, many kinds of embedded processors with advanced architectures have emerged, which provides the basis of the hardware for the systems with higher speed. 由于半导体芯片设计制作工艺不断提升,各种先进架构的嵌入式处理器纷纷涌现,在硬件基础上为系统的运行速度提供了保证。